Thermal Analysis

When a product incorporates components that transfer some of their heat energy into the package there is always a concern that the heat will not be adequately dissipated resulting in permanent damage to sensitive devices and possibly even to the package itself.

At Byrd Technology Group, not only do we have over 20 years of experience in thermal design, but we have over 30 years of electronics packaging experience that enables us to incorporate heat dissipation concepts directly into the package. Whether it is a fan that snaps into the plastic package or a stamped plate that carries the heat directly from component cases to the ambient air, we have the experience to keep the thermal performance at its highest level while keeping the cost at its lowest.

Save time and money

Typically a thermal analyst is brought into the product design cycle after much of the PCB design is done. Often the package has also been through the Industrial Design phase and possibly even the Mechanical Design as well. At this stage, if the thermal analysis reveals a heat transfer problem, the range of solutions is limited and costly. Our ability to simultaneously design and analyze insures the most cost effective thermal solution is used and is integrated into the enclosure design, not added on to it.

Byrd Technology Group offers a range of engineering experience and skill that will reduce your product design cycle by ensuring that your product will meet both design and thermal requirements.

We specialize in:

	CFD (Computational Fluid Dynamic) Analysis
	Component Level Analysis
	Fan Specification
	Heatsink Design
	Baffling and System Balancing
	Solar Loading
	Transient and Steady State Studies

Contact us today for a quote or more information about our engineering services.